Münür Arat

Angestellt, Hardware Projektmanager, Harman International

Ulm, Deutschland

Fähigkeiten und Kenntnisse

ASIC
DSP
Board Design
High Speed Interfaces
Ethernet
RapidIO
FPGA
microprocessors
Digital Product Development
Signal Integrity
High Speed Methodology
PCB Technologies
HF-Messtechnik
Wireless Technologies
Baseband Hardware
Digital Design
PCB Design
Interconnections
Clock Design
Clock Distribution
I2C
Requirements Engineering
Requirements Analysis
Hardwareentwicklung
Jitter Measurements
Digital Measurements
high speed digitital design
Hardware Design
Project Management
Projektplanung
Projektarbeit
Prozessmanagement
Prozeßoptimierung
Requirement Management
internationale Erfahrung
Simulationen
High Speed Serial Interfaces
Kommunikationsfähigkeit
Teamfähigkeit
Teamleitung
Riskmanagement
Stressmanagement
Getting Things Done
Persuasive Kommunikation
Girişimcilik
Entrepreneurship
Technical Documentation
Projektmanagement
Teamentwicklung
Teambuilding
Hardware
Design
Technical project management
Englische Sprache

Werdegang

Berufserfahrung von Münür Arat

  • Bis heute 6 Jahre und 4 Monate, seit März 2018

    Hardware Projektmanager

    Harman International

  • 2 Jahre und 10 Monate, Mai 2015 - Feb. 2018

    Technical Project Manager

    Nokia Networks

  • 8 Jahre und 11 Monate, Apr. 2009 - Feb. 2018

    Senior Hardware Designer

    Nokia Networks

    High Speed Digital Hardware Design, design team leader.

  • 1 Jahr, Mai 2008 - Apr. 2009

    PCB Design Engineer - Consultant

    Nokia GmbH

    PCB Design

  • 1 Jahr, Juni 2007 - Mai 2008

    PCB Design Engineer

    Vestel Elektronik AS

    Hardware Design

  • 6 Monate, Jan. 2007 - Juni 2007

    Hardware Design

    GEST Elektronik Ltd. Sti.

    Hardware Desing

Ausbildung von Münür Arat

  • 3 Jahre und 10 Monate, Sep. 2001 - Juni 2005

    Electronics Engineering

    Kadir Has Universitesi

    Communication Electronics

Sprachen

  • Englisch

    Fließend

  • Deutsch

    Gut

  • Türkisch

    Muttersprache

  • Russisch

    Grundlagen

Interessen

embedded systems
sensors
emc
emv
signal integrity
radio
digital design
wireless
LTE
3G
communications
internet
technology
messen
design
electronics
silicon
IC design
FPGA design
microwave
high frequency
clock distribution
RapidIO interface
High speed digital interfaces
ethernet
cost down
project management
PWB
PCB
layout
high speed signals
hardware design
integration
engineering
verification
test
wireless
mobile
LTE
WCDMA
i2c
ethernet
RapidIO
USB
SRIO
FPGA
Microprocessor
Mikrorechner
entwicklung
messung
ASIC
DSP Board Design
High Speed Interfaces
Ethernet
RapidIO
FPGA
Synchronization
Digital Product Development
Signal Integrity
High Speed Methodology
PCB Technologies and cost down activities
Wireless Technologies
Baseband Hardware
Digital Design
Layout
Interconnections
PWB
clock design
cost down
RFID
high speed
clock
jitter
FPGA
I2C
SRIO
RapidIO
PCB Design
Flex PCB
FPC
IC design
measurement
integration verification
jitter measurement
BER measurement.

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