Uday Deshpande

Angestellt, Senior Firmware Engineer, Qualcomm

Bengaluru, Indien

Fähigkeiten und Kenntnisse

Engineering
Embedded Systems
Audio
Wireless technology
Firmware
Bluetooth
C-Programmierung
Audio Engineering
Noise cancellation

Werdegang

Berufserfahrung von Uday Deshpande

  • Bis heute 4 Jahre und 11 Monate, seit Aug. 2019

    Senior Firmware Engineer

    Qualcomm

  • 3 Jahre und 1 Monat, Juli 2016 - Juli 2019

    Firmware Engineer

    Intel

Ausbildung von Uday Deshpande

  • 3 Jahre und 11 Monate, Juli 2012 - Mai 2016

    Electrical and Computer Engineering

    P.E.S. Institute of Technology

XING Mitglieder mit ähnlichen Profilangaben

Tejas Ahobala

Hardware-Entwickler

Munich

Lukas Obkircher

Co-Founder and CTO

München

Andrew Cahill

Director of Recruiting, Engineering

Cork

Stefanos Anastasiou

Senior Software Engineer

Lichtenfels / Bayern

Vladislav Bogdanov

Solution Architect

Berlin

Chris Hodges

Inhaber

Lund

Benjamin Eggerstedt

Director Technical Sales and Services DATA Europe & North

Hamburg

Alexander Vanaev

Radar System Architect

Bietigheim-Bissingen

Lothar Wagner

IT Consultant

Werther Westf.

Sven Rau

Firmware Engineer

Bonn

Sharada Prasad Shantharam

Communications Engineering

Munich

Torsten Prange

Senior Firmware Engineer

Dresden

Gerhard Stein

Maschinenbau / Energieprozesstechnik

Darmstadt

Bhupendra Naphade

Software Engineer

Munich

DANIAL AHMAD ZAKI

Embedded System / Firmware Engineer

Furtwangen

Gökçen Özçelik

Research and Development Engineer

İstanbul

James Toynton

Principal Recruiter - International R&D and Semiconductors

London

David Gorski

E-CAD Administrator & PCB Layouter

Neuss

Amr Aboushehata

Communications Technology

Ulm

Andrii Yakymenko

---

Rottweil

21 Mio. XING Mitglieder, von A bis Z

Nachname:

ABCDEFGHIJKLMNOP
QRSTUVWXYZ